Electronic Modules

Image sensors and camera modules for handheld devices, such as smartphones and tablets, are constantly evolving, enabling handheld device manufacturers to differentiate their products in the market place. This fast moving, innovative market consistently demands better and more sophisticated adhesive technologies to help deliver existing and next generation camera module assembly solutions. With our full range of innovative adhesive solutions, we provide the following to the image sensor market:

• One component, premixed adhesives with long RT work life
• Industry-leading thermal cure kinetics offering lower temperature cure at short cure times
• UV command cure solutions
• High adhesion to a variety of substrates, including glass, metals and common low temperature stability plastics (PC, LCP, PA, PBT and PPA)
• High reliability
• Low stress
• Easy processing liquid paste
• Controlled flow solutions
• Lower total cost of ownership

Bonding applications in image sensors and camera module assembly:

• House bonding
• Active alignment
• Die attach
• Glass attach
• Flip chip side fill
• Lens barrel bonding
• Electronic Encapsulation
• FPC reinforcement
• Conductive grounding

Camera Module Assembly

• Lens holder to substrate (house bonding)
• IR filter bonding
• Active alignment of lens holder
• Voice coil motor (VCM) spacer bonding
• Wire bond encapsulation
• Underfill solution
• FPC Reinforcement
• Flip chip side file

Fingerprint and Touch Sensor Assembly

Fingerprint recognition and touch sensor technology for handheld devices, such as smartphones and tablets, is a rapidly growing market segment that is constantly evolving and innovating. The adhesive applications in fingerprint or touch sensor assembly are numerous and also require highly innovative and specialized adhesive materials. Use of heat-sensitive plastics and metals, like ITO, mean elevated cure temperatures cannot be used to assemble these devices. In addition, some bonding processes require that the adhesive does not flow during attachment, can be processed at low temperatures, and provides a strong and reliable bond. Our range of liquid and film material solutions are designed to meet the bonding challenges in fingerprint and touch sensor assembly.

H.B. Fuller’s adhesives for the handheld device market typically offer the following characteristics:

• One-part, premixed adhesives with long RT work life
• Industry-leading, thermal cure kinetics offering lower temperature cure at short cure times
• UV command cure solutions
• High adhesion to a variety of substrates, including glass, metals and common low temperature stability plastics (ITO, SUS, PC, PA, PBT and PPA)
• High reliability
• Low stress
• Easy processing liquid paste and film solutions
• Controlled flow solutions
• Lower total cost of ownership

Typical bonding applications in fingerprint and touch sensor assembly for handheld devices are:

• Glass to sensor
• Sensor attach
• Controller attach
• Glass to SUS
• Gap fill
• Electronic Encapsulation